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SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX9996’s 20-pin thin
QFN-EP package provides a low thermal-resistance
path to the die. It is important that the PC board on
which the MAX9996 is mounted be designed to con-
duct heat from the EP. In addition, provide the EP with a
low-inductance path to electrical ground. The EP MUST
be soldered to a ground plane on the PC board, either
directly or through an array of plated via holes.
Chip Information
TRANSISTOR COUNT: 1414
PROCESS: SiGe BiCMOS
Table 1. Component List Referring to the Typical Application Circuit
COMPONENT
L1, L2
L3
C1
C4
C2, C6, C7, C8, C10, C12
C3, C5, C9, C11
C13, C14
C15
R1
R2
R3
T1
U1
VALUE
470nH
10nH
4pF
10pF
22pF
0.01 μ F
150pF
150pF
806 ?
549 ?
7.15 ?
4:1 balun
MAX9996
DESCRIPTION
Wire-wound high-Q inductors (0805)
Wire-wound high-Q inductor (0603)
Microwave capacitor (0603)
Microwave capacitor (0603)
Microwave capacitors (0603)
Microwave capacitors (0603)
Microwave capacitors (0603)
Microwave capacitor (0402)
± 1% resistor (0603)
± 1% resistor (0603)
± 1% resistor (1206)
IF balun
Maxim IC
Pin Configuration/Functional Diagram
20
19
18
17
16
V CC 1
15 LO2
RF 2
TAP 3
GND 4
GND 5
MAX9996
14 V CC
13 GND
12 GND
11 LO1
6
7
8
9
10
10
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相关PDF资料
MAX9996EVKIT
EVAL KIT FOR MAX9996
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